Nano-Coating is a surface modification technique that applies a thin, uniform, hydrophobic (non-stick) layer—typically based on fluoropolymer or ceramic nano-compounds—to the stencil’s surface and aperture walls.

Benefits include:

Significant reduction in solder paste adhesion to the stencil surface

Improved paste release from apertures, even for complex or high aspect ratio designs

Extended printing cycles with fewer cleaning interruptions

Improved first-pass yield and reduced bridging, especially in fine-pitch and high-density assemblies

Nano-coating is especially valuable in high-speed, high-volume SMT lines, or when working with lead-free solder pastes, which tend to have higher viscosity and increased tackiness.

Electropolishing is an electrochemical surface treatment process that removes a controlled layer of material from the stencil's aperture walls. This process smooths and deburrs the microscopic peaks and valleys left by the laser cutting process, resulting in:

Reduced surface roughness (Ra) for enhanced solder paste flow

Improved aperture geometry, especially in fine-pitch designs

Minimized paste clogging, contributing to better transfer efficiency and consistency

Enhanced stencil lifespan due to lower mechanical abrasion during cleaning

This process is particularly beneficial for stencils used with 01005 and 0201 components, BGA/CSP packages, or boards with tight pitch and small apertures, where solder paste volume control is critical.